January 21, 2009
One of the issues currently facing the industry has been an increase in the head-in-pillow (BGA) soldering defect primarily related to warpage of the board or BGA/CSP components during reflow soldering. Typically this has occurred more often during lead-free soldering where higher soldering temperatures increase the warpage affect of the BGA/CSP component or board increasing the defect tendency. In 2007, Koki developed a lead-free solder paste Koki M406-3 Sn3Ag0.5Cu which helped to reduce this affect which is currently successfully used in locations around the world. Tin-lead soldering operations are not immune and in 2006 Koki developed the M956-2 Sn37Pb Anti- Head in Pillow paste to reduce the affect in tin-lead soldering applications. Both pastes were developed and evaluated using internally developed test methodologies specifically designed to assess and find solutions for this issue.
For further information contact:
Martin Gershenson
Christopher Associates Inc.
3617 W. MacArthur Blvd.
Suite 507
Santa Ana, CA 92704, USA.
Tel: (714) 979-7500
martin@christopherweb.com