April 16, 2009
Koki announces approval by major telecommunications manufacturer of Head In Pillow solder pasteKoki Company Ltd. (Tokyo, Japan) today announced approval by a major Japanese manufacturer of telecommunications infrastructure of the S3X-48-M406 Series solder paste, developed specifically to address head in pillow defects.
S3X48-M406 solder paste offers excellent printability on very fine pitch (0.4Mmm/16 mil) and CSP devices with long stencil idle time. Melting & wetting is excellent, and specially formulated flux chemistry ensures very low voiding.
One of the issues presented in the application was the development of test procedure specific to head in pillow defects, which occur underneath BGA and CSP components and are a significant cause of field failures. In cooperation with their customer, Koki developed a suite of tests that helped define performance and process issues. Based upon this, the product was optimized and successfully implemented in high volume production.
For further information, including test protocols and performance data, please contact Christopher Associates Inc. or visit www.christopherweb.com.
Contact:
Martin Gershenson
Director of Business Development
Christopher Associates Inc.
3617 W. MacArthur Blvd.
Santa Ana, CA 92704
714-979-7500
E mail:
martin.gershenson@christopherweb.com