Automated Solder Paste Inspection (SPI) has been deployed in a broad range of electronics assembly operations because it saves money. By preventing print defects from becoming solder defects, the SPI technology helps manufacturers avoid the costs of rework, test failure, scrap and even field failures.

This presentation reviews different applications of SPI and simple experiments that can be performed quickly during production breaks to improve printing processes and prevent print defects from occurring. Topics covered include stencil verification, vendor qualification, material type, solder powder size and paste formulation, and how to mine through production data to pinpoint the root causes of defects. 

Click here to download the presentation.