This presentation begins with a review of the basic mechanics of solder paste printing, the key elements of a robust process, the principles of automated inspection, and typical methods of process control. It continues with the general steps used to check a process that is not producing good prints, and then moves into specific defects like solder bridges, insufficient deposits, and poor print definition, showing images of the defects and discussing the most common causes of them in a typical production environment.

The presentation is designed to provide practical, useful troubleshooting skills for beginner to intermediate level SMT process engineers, technicians or production support personnel. 

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