October 25, 2011
Automatic Solder Paste Inspection has been proven time and again to save assemblers money by catching print defects before they become soldering defects. But there's more to the technology than just catching defects - it can be used to prevent them! This white paper and presentation contain case studies from SPI power users on how to run quick, easy tests to verify stencil quality, choose materials and suppliers, select solder paste types and and dial in process parameters.
Can you get 20 minutes of printer/SPI line time during a lunch break or changeover? Do you want to raise your print and end-of-line yields? Then
click here to read on!
Click here for Chrys Shea's presentation on this subject.