The electronics industry has widely adopted Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. One of the challenges with this alloy is the use of the three percent silver which has caused rapid price increases in lead-free solder alloys because of the limited global availability of silver metal.

Koki has developed a low silver lead-free alloy solder paste to help to address this need which has shown good process and reliability performance. Jasbir Bath, Consulting Engineer for Christopher Associates, presented at the SMTAI 2011 technical conference last week in Fort Worth, Texas on the Koki Low silver alloy solder paste. Click here for the paper, or here for the presentation.