Surface Mount Adhesives for chip attach through solder wave
These are silica filled epoxies ideal for chip attach during wave solder and double sided reflow. They can also be used for microBGA and BGA corner bonding to structurally reinforce these components against drop test failures (cell phones and other hand held devices demonstrate this need best). This is red for high color contrast, are dispensable at high or low speeds and demonstrate consistent, high profile dots.
- Excellent dispensability
- Excellent green strength
- Excellent adhesive through the wave solder process
- Fast cure
JU-100-5 - Dispensing
JU-41P & JU-44P - Printing
JU-90LT - Dispensing w/ low temp cure (glass diodes)
Koki has a range of other materials for specific applications. Feel Free to call to learn about other materials to fit your needs. Feel Free to call to learn about other solder wires to fit your needs.