Semblant Plasma Finish is a new, revolutionary patented process for PCB surface finishing and other protective applications. The patented SPF™ (Semblant Plasma Finish) improves PCB corrosion resistance, extends shelf life and enhances soldering capabilities. A 40-50 nanometer thin fluoropolymer film is applied to all exposed surfaces and vias of the printed circuit board giving superior levels of protection against both atmospheric and liquid corrosion, compared with ENIG (today’s premium finish) by a factor of 10 to 1 or better in manufacturing testing. SPF™ is applied at room temperature with a plasma polymerization process. The SPF™ is both economically sound and environmentally friendly.
Key SPF™ Performance Features:
- Solder through capability gives exceptional inter-metallic bonds for strong joints with excellent long-life performance
- Compatible with current reflow and wave-flow processes
- Will work with lead-free solder
- Solderable after multiple reflow cycles
- Coats micro-fine features and vias
- Enables fine-pitch BGA soldering
- Provides superior resistance to corrosive environments
- Does not impact high frequency signal performance
SPFTM is the Environmentally Responsible/ Green Alternative for PCB Fabrication.
- Reduces water consumption – SPF is a dry deposition process
- Generates no hazardous waste
- Alleviates the need to treat waste chemicals
- Non-toxic exhaust can be vented directly to the atmosphere or run through a chemical scrubber
- Eliminates heavy metal usage from finishing lines
- Plasma treatment uses no solvents
- Uses no greenhouse gases
- Minimizes materials usage – very small quantities of a chemical precursor gas is used
- Reduces energy consumption by as much as 90%
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