Koki offers range of high performance lead-free solder pastes with high purity non-oxidized solder powders.
Specially developed high temperature resistant no-clean flux systems ensure as high soldering quality as conventional lead containing solder pastes realizing excellent fine pitch and micro components printability, and powerful solderability even in air reflow.
S3X48-M410-A, S3X70-M410-A, and S3X58-M650-3 - Lead-free, Halogen-free solder paste
- Excellent Solderability and print quality.
- <900 ppm Bromine
- <900 ppm Chlorine
- 01005 process compatible
- S3X48-M410A and S3X70-M410A are tailored specifically for the prevention of the head-in-pillow defect
- S3X58-M650-3 is designed for good ICT pin probeability.
S3X48-M406-3, S3X70-M407-4 and S3X48-M406-5 - Anti-pillow solder paste
- Ensure the quality of solder joints with outstanding continual printability.
- Designed for super fine pitch and CSP applications.
- S3X48-M406-3 is tailored for prevention of hidden pillow defect.
- S3X70-M407-4 is designed to prevent dislocation of small components.
S3X48-M420 - Low-void solder paste
- Specially formulated flux chemistry ensures Extremely low voiding with CSPs and broad contact area components, e.g. QFN.
- Super Low-Void S3X48-M420
- Solder alloy composition is Sn3.0Ag0.5Cu.
- Ensures outstanding continual printability with super fine pitch (0.4mm/16mil) and CSP (>0.3mm dia.) applications for normal to fast printing (10 ~ 120mm/sec.) and long stencil idle time.
SB6N58-A730-3 - Low Melting point & Anti-Crack Alloy
- Uses high Indium content solder alloy for thermal-cycling crack free.Alloy composition is Sn/3.5Ag/0.5Bi/6.0In.
- Suffers less deformation by heat and retains reliability in severe usage environment.
TB48-M741 - Low Melting point alloy solder paste
- Replace SnAgCu alloy to Low melting point solder possible to redReplace SnAgCu alloy to Low melting point solder possible to reduce CO2 emission by 40%.
- Ensures outstanding wetting