The 3D Profiler is an automatic machine to measure the dent of the copper filled vias. The system offers the opportunity for 100% inspection to ensure the yield of the copper filling with inspection speeds of 5 minutes per panel and +/- 2 micron accuracy.
- Automatic measurement of copper filled vias, 100 % of vias measured.
- Measure depth of vias after thin copper plating on ABF material.
- Measure depth of dent after copper filling.
- Measure depth of dent when pattern is presented.
- 10,000 times faster the traditional 3D (point to point) tools.