Thanks to the newly blended vehicle with excellent wettability on metal surfaces, it has achieved a thin and uniform flux layer. Excellent wettability is realized by removing the OSP/Oxide film on the board pad in the preheating stage, securely preventing re-oxidization, and promptly spreading the active ingredients of the flux over the interface with the molten solder.
JS-EU-01
- Low solids formulation drastically reduces bridging, blow holes and solder balling
- Significant improvement in through-hole filling with OSP boards.
- Extremely low residue despite a powerful soldering action
JS-3000V
- Designed for lead free wave soldering process with various solder alloys, suchas SnAgCu, SnAg and SnCu systems.
- Very low residue flux with excellent reliability - chemically and electrically stable under a variety of operating environments, and requires no cleaning after soldering.
- Employment of special vehicles effectively prevent formation of oxide film to the molten solder in contact with the substrate and ensures sufficient through hole filling despite of low solids content.
- Suitable for both leaded and surface mount components.