Giga Solar Materials Corporation (GSMC) offers a line of thick film metallization pastes specifically designed for use in the construction of photovoltaic solar cells. The pastes offered include Silver (Ag) paste suitable for use as a front side conductor, Aluminum (Al) paste for use as the back electrode and Silver/Aluminum (AgAl) for use as a back side conductor on an Aluminum Back Surface Field. These pastes were developed with the understanding that the physical and functional requirements of the front side and back side of the photovoltaic substrates require significant differences in the properties of the metallization pastes.
Front Conductor Ag Paste - Lead-Free
- Suitable for SiNx ARC’s
- 75µm Narrow Grid
- Low contact resistance
Rear Electrode Al Paste – Lead-Free
- High efficiency
- Low bowing
- Screen printable
Rear Conductor AgAl Paste – Lead-Free
- High adhesion with Si wafer and tabbing ribbon
- Compatible with Al paste
- Low resistance